Important Dates

Journal track paper:
submit now, max Apr 1, 2017


Paper submission (TT):
Apr 15, 2017 May 1, 2017

Paper acceptance (TT):
May 31, 2017

Camera-ready:
Jun 15, 2017


Doctoral Symposium & BAAI session:
Paper submission: Jun 15, 2017
Paper acceptance: Jul 15, 2017
Camera-ready: Jul 25, 2017


Discovery Challenge:
Predictions: Jun 1, 2017
Papers: Jul 8, 2017 Jul 31, 2017

Geometry Friends:
Aug 8, 2017


Conference:
Sep 5-8, 2017

Contact

epia2017@fe.up.pt

Embedded systems have been small-scale and standalone, but recent advances in computing and communication technologies including the wide adoption of internet-connected devices are pulling the concept of Cyber-Physical Systems (CPS) as the pervasive bridge between the real world (of people and equipments) and information (cyber) technologies. Internet of Things, Web of Things and “Smart Systems” environments are some examples of these systems, which have become exciting application fields for artificial intelligence: multi-agent systems, data mining, expert systems, etc. AI methodologies, models and tools have to face numerous challenges when facing the new requirements of CPS. For example, designers have to pay particular attention to nonfunctional requirements as the limited resources (memory, CPU), energy consumption, safety of equipment and people, delay-tolerant communication, autonomy in decision making, etc.

SCOPE

The aim of this thematic track is to present recent works on the use of Artificial Intelligence (AI) in the context of cyber-physical and distributed embedded systems, including the growing need for “Smart Systems” which present intrinsic relationship between AI and hardware, software and human participants. Research in this area comprises Internet of Things (IoT), collective robotics, smart grids, smart cities, etc. Regarding the field practical aspects, scientific and demonstration papers can address applied research on how models and technologies from AI particularly meet the following challenges:

  • Integration of services/data carried by CPS;
  • Models and paradigms to enable interaction between CPS;
  • Human position in the cyber-physical world (ethics, security, confidentiality, protection of privacy, access control to the information carried by the objects);
  • Discovery, composition and management of “physical” services.

TOPICS OF INTEREST

The thematic track will be structured around the following applicative areas:

  • Applied Artificial Intelligence and real-life applications of AI
  • Cyber-Physical Systems (CPS)
  • Web of things
  • Internet of things (IoT)
  • Collective robotics
  • “Smart Systems” in different domains (transportation, electricity, etc.)
  • Embedded Multi-Agent Systems
  • Machine Learning / Deep Learning Applications
  • Cloud / Edge Internet of Things
  • Distributed Big Data Analytics
  • Collaborative Robotics
  • Intelligent Agent Applications

The contribution of papers must can be related (not limited to) artificial intelligence including:

  • Specification and modelling,
  • Design methodology,
  • Pervasive trust and privacy,
  • Cyber-Physical Systems governance,
  • Self-* properties,
  • Simulation of software/hardware mixed agent systems,
  • Authentication and Authorization,
  • Physical service description, planning, coordination and composition
  • Communication networks and middleware,
  • Things “social” aspect (identification and management of things communities),
  • Specific decentralized architectures,
  • Real-time aspects in thing decision making,
  • Information retrieval and management,
  • Power-efficient design,
  • Intrusion Detection and Processing
  • Dependability and fault tolerance,
  • Case studies.

JOURNAL SPECIAL ISSUE

Authors of the best papers presented at the AICPDES 2017 track of EPIA will be invited to submit extended versions of their manuscripts for a special issue of the International Journal of Social Computing and Cyber-Physical Systems (ISSN: 2040-073X, Inderscience).

Further information on this Special Issue can be found at the journal website: http://www.inderscience.com/jhome.php?jcode=ijsccps
ORGANIZING COMMITTEE
  • Jean-Paul Jamont, Univ. Grenoble Alpes, France
  • Stamatis Karnouskos, SAP, Germany
  • Thiago RPM Rúbio, FEUP / LIACC, Porto, Portugal
  • Henrique Lopes Cardoso, FEUP / LIACC, Porto, Portugal

PROGRAM COMMITTEE (To be completed)

  • Olivier Boissier, ENS Mines Saint-Etienne, France
  • Luis M. Camarinha-Matos, New University of Lisbon, Portugal
  • Jose Francisco Cervantes Alvarez, ITESO, México
  • Yacine Challal, Ecole nationale Supérieure d’Informatique, Algeria
  • Vincent Chevrier, Université de Lorraine, France
  • Armando Colombo, University of Applied Sciences Emden/Leer, Germany
  • Natalia Criado, King’s College London, England
  • Christopher Frantz, University of Otago, New Zealand
  • Benjamin Gateau, Luxembourg Institute of Science and Technolog, Luxembourg
  • Marie-Pierre Gleizes, IRIT – Université de Toulouse, France
  • Jean-Paul Jamont, Univ. Grenoble Alpes, France
  • Stamatis Karnouskos, SAP,  Germany
  • Mouloud Koudil, Ecole nationale Supérieure d’Informatique, Algeria
  • Paulo Leitao, Polythecnic Institute of Braganca, Portugal
  • Claude Le Pape, Schneider Electric, France
  • Laurent Lefevre, G.INP, France
  • Henrique Lopes Cardoso, FEUP/LIACC, Portugal
  • Marin Lujak, Ecole des Mines de Douai, France
  • Simon Mayer, SIEMENS, USA
  • Marco    Mendes, Schneider Electric Automation GmbH, Germany
  • Michael Mrissa, Université de Pau et des Pays de l’Adour, France
  • Thanh Binh Nguyen, Danang University of Technology, Viet-Nam
  • Michel Occello, Univ. Grenoble Alpes, France
  • Gauthier Picard, ENS Mines Saint-Etienne, France
  • Clément Raievski, LCIS – Grenoble-Alpes University, France
  • Juan Antonio Rodriguez Aguilar, IIIA-CSIC, Spain
  • Thiago R.P.M. Rúbio, LIACC/DEI – University of Porto, Portugal
  • Tiberiu Seceleanu, ABB Corporate Research, Sweden
  • Vlasios    Tsiatsis, Ericsson Research – Ericsson AB, Sweden
  • Laurent Vercouter LITIS lab, INSA de Rouen, France
  • Alois Zoitl, Fortiss Gmbh, Germany